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Qualcomm Unveils Snapdragon S7 and S7 Pro Gen 1 Sound Platforms with Enhanced Audio and Connectivity Features

Qualcomm has unveiled the latest addition to its audio chip lineup, the Snapdragon S7 and S7 Pro Gen 1 Sound platforms with Bluetooth 5.4. The S7 Pro incorporates micro-power Wi-Fi, capable of speeds up to 29 Mbps, which extends the range of earbuds significantly, allowing seamless transitions between Bluetooth and Wi-Fi. Qualcomm claims this technology will enable users to walk around their home, buildings, or campuses while maintaining a stable audio connection.

These new platforms offer increased computational power, with the S7 and S7 Pro providing "six times the compute power" and nearly 100 times more AI power compared to previous generation platforms. They feature a dedicated Micro NPU AI engine, ensuring AI capabilities in headphones and earbuds. This on-device AI enhances hearing enhancement technologies to adapt to user needs throughout the day, automatically switching between ANC modes based on the immediate environment.

Additionally, the S7 and S7 Pro include 4th Gen ANC (Active Noise Cancellation) and multiple DSP cores, alongside a sensor hub and a 300% increase in memory compared to the previous generation (S5 Gen 2). The S7 Pro supports 192kHz multi-channel lossless music streaming and enhanced multi-channel spatial audio for gaming, offering an improved and immersive audio experience for users.


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