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MediaTek, the Taiwanese chip manufacturer, has unveiled a mid-year update to its flagship smartphone processor, the Dimensity 9200 Plus. This upgraded version boasts improvements in clock speeds for both the CPU and GPU, aiming to enhance overall performance. Specifically, the Cortex-X3 big core now operates at 3.35GHz, up from its previous 3.05GHz, while the Cortex-A715 medium cores have been elevated to 3GHz from 2.85GHz. Although the exact GPU clock speed boost remains undisclosed, it amounts to a 17% increase in performance. Additionally, the Dimensity 9200 Plus retains its predecessor's features, such as an M80-based modem with mmWave 5G support, a sixth-generation APU, support for refresh rates of up to 240Hz at FHD+ resolutions, 8K video recording capabilities, Bluetooth 5.3, and Wi-Fi 7.
The vivo X90 Pro, which is currently the only smartphone on the global market powered by the Dimensity 9200, has demonstrated competitive single-core CPU and GPU performance. However, it lagged behind in multi-core CPU scores and GPU stress testing. The Dimensity 9200 Plus is expected to offer a significant performance boost, although it remains to be seen whether these clock speed enhancements will address the previous weaknesses in multi-core CPU scores and GPU stress tests. The first smartphones featuring the Dimensity 9200 Plus are set to launch later this month, although specific availability details are still pending.
This updated processor from MediaTek will enter direct competition with Qualcomm's Snapdragon 8 Gen 2 for Galaxy processor, another high-end smartphone chipset. While the Dimensity 9200 Plus boasts a peak clock speed of 3.35GHz, the Snapdragon 8 Gen 2 offers a slightly higher 3.36GHz clock speed. However, the Snapdragon 8 Gen 2 has gained recognition for its exceptional GPU performance and AI capabilities, raising questions about whether the Dimensity 9200 Plus can match or surpass these features. Nonetheless, this mid-year refresh is expected to be well-received, providing smartphone manufacturers with a more powerful chipset to integrate into their upcoming devices and potentially offering consumers enhanced performance and features in their next smartphones.
